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Volumn , Issue , 2001, Pages 209-215

Multiple Probe Deep Sub-Micron Electrical Measurements Using Leading Edge Micro-Machined Scanning Probes

Author keywords

[No Author keywords available]

Indexed keywords

REAL-TIME ELECTRICAL SIGNAL MEASUREMENTS;

EID: 1542270708     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (11)
  • 1
    • 0030243510 scopus 로고    scopus 로고
    • Focused Ion Beams Help Debug Analog and Mixed-Signal Devices
    • Sept.
    • T. Lundquist, J. Brown, "Focused Ion Beams Help Debug Analog and Mixed-Signal Devices", Semiconductor International, Sept., 135 (1996)
    • (1996) Semiconductor International , pp. 135
    • Lundquist, T.1    Brown, J.2
  • 2
    • 0026823119 scopus 로고
    • Test Chip for the Characterization of Electron Beam Measurement Systems
    • H. Richter, "Test Chip for the Characterization of Electron Beam Measurement Systems", Journal of Microelectronics Eng. 16,225 (1992)
    • (1992) Journal of Microelectronics Eng. , vol.16 , pp. 225
    • Richter, H.1
  • 6
    • 0003645340 scopus 로고    scopus 로고
    • Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated Circuits
    • Santa Clara, California
    • K. Krieg, R. Qi, D. Thomson, G. Bridges, "Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated Circuits", Proc. 25th Intl. Symp. Test Failure Analysis, Santa Clara, California, 39 (1999)
    • (1999) Proc. 25th Intl. Symp. Test Failure Analysis , pp. 39
    • Krieg, K.1    Qi, R.2    Thomson, D.3    Bridges, G.4
  • 10
    • 0033700294 scopus 로고    scopus 로고
    • A High Performance 0.13μm SOI CMOS Technology with Cu Interconnects and Low-k BEOL Dielectric
    • P. Smeys et al., "A High Performance 0.13μm SOI CMOS Technology with Cu Interconnects and Low-k BEOL Dielectric", Symp. on VLSI Tech., 184 (2000)
    • (2000) Symp. on VLSI Tech. , pp. 184
    • Smeys, P.1
  • 11
    • 1542270709 scopus 로고    scopus 로고
    • Electrical Characterization of Circuits with Low K Dielectric Films and Copper Interconnects
    • Santa Clara, California
    • T. Kane, P. McGinnis, B. Engel, "Electrical Characterization of Circuits with Low K Dielectric Films and Copper Interconnects", Proc. 27th Intl. Symp. Test Failure Analysis, Santa Clara, California, (2001)
    • (2001) Proc. 27th Intl. Symp. Test Failure Analysis
    • Kane, T.1    McGinnis, P.2    Engel, B.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.