Enhancement of CMOS performance by process-induced stress

IEEE Transactions on Semiconductor Manufacturing

Volumn 18, Issue 1, 2005, Pages 63-68

  Luo, Yuhao ^a   Nayak, Deepak K ^a  

^a XILINX INC   (United States)

Author keywords

CMOS; STI; Stress

Indexed keywords

COMPRESSIVE STRESS; DATA ACQUISITION; MOSFET DEVICES; NITRIDES; SILICON WAFERS; TENSILE STRESS;

DIFFUSION CAPACITANCE; DIFFUSION WIDTH; SHALLOW TRENCH ISOLATION (STI); SOURCE/DRAIN (S/D) SILICIDES;

CMOS INTEGRATED CIRCUITS;

EID: 13844275613     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2004.841831     Document Type: Article

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