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Volumn 277, Issue 1-2, 1996, Pages 138-143
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Stability of interfaces in Mo/Cu multilayered metallization
a a a b c c d d |
Author keywords
Copper; Interfaces; Molybdenum; Multilayers
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Indexed keywords
ANNEALING;
COPPER;
DIFFUSION;
MAGNETRON SPUTTERING;
METALLIZING;
MOLYBDENUM;
MULTILAYERS;
NITRIDES;
RUTHERFORD BACKSCATTERING SPECTROSCOPY;
SCANNING ELECTRON MICROSCOPY;
SILICON WAFERS;
VACUUM APPLICATIONS;
CONDUCTING LAYERS;
DIFFUSION BARRIERS;
ELECTRON DIFFRACTION SPECTROSCOPY;
GRAIN BOUNDARY DIFFUSION;
GRAZING INCIDENCE CONFIGURATIONS;
INTERFACE STABILITY;
INTERMIXING;
MULTILAYERED METALLIZATION;
RESISTOMETRY;
INTERFACES (MATERIALS);
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EID: 0030142693
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/0040-6090(95)08014-7 Document Type: Article |
Times cited : (12)
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References (15)
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