On-chip SiGe transmission line measurements and model verification Up to 110 GHz

IEEE Microwave and Wireless Components Letters

Volumn 15, Issue 2, 2005, Pages 65-67

  Zwick, Thomas ^a,b   Tretiakov, Youri ^c,d   Goren, David ^e  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b SIEMENS AG   (Germany)

^c IBM MICROELECTRONICS   (United States)

^d RF Micro Devices   (United States)

^e IBM HAIFA RESEARCH LAB   (Israel)

Author keywords

De embedding; On wafer measurements; Transmission line interconnect

Indexed keywords

CAPACITORS; COMPUTER SIMULATION; ELECTRIC LINES; INDUCTANCE; MICROPROCESSOR CHIPS; MICROSTRIP LINES; PARAMETER ESTIMATION; PRODUCT DESIGN;

DE-EMBEDDING; MODEL VERIFICATION; ON-WAFER MEASUREMENTS; TRANSMISSION LINE INTERCONNECT;

SILICON COMPOUNDS;

EID: 13844255402     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2004.842817     Document Type: Article

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