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Volumn , Issue , 2004, Pages 69-72
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A new on-wafer de-embedding technique for on-chip RF transmission line interconnect characterization
b
IBM
(United States)
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Author keywords
De embedding; On wafer measurement; S parameters; Transmission line interconnect
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Indexed keywords
CHARACTERIZATION;
CHIP SCALE PACKAGES;
COMPUTER SIMULATION;
COUPLED CIRCUITS;
ELECTRIC LINES;
EMBEDDED SYSTEMS;
SCATTERING PARAMETERS;
DE-EMBEDDING;
ON-CHIP RF TRANSMISSION LINES;
ON-WAFER MEASUREMENT;
TRANSMISSION LINE INTERCONNECT;
WSI CIRCUITS;
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EID: 13844249409
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (25)
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References (6)
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