Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 4, 2002, Pages 509-513

  Lin, Kwang Lung ^a   Hwang, Jia Wei ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Crystallinity; Diffusion barrier; Electroless nickel; Flip chip; Solder

Indexed keywords

COPPER; CRYSTALLINE MATERIALS; DIFFUSION; ELECTROLESS PLATING; FLIP CHIP DEVICES; INTERMETALLICS; NICKEL;

DIFFUSION BARRIERS;

SOLDERING ALLOYS;

EID: 0036881789     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.807606     Document Type: Article

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