How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the Therminic 2002

Microelectronics Journal

Volumn 34, Issue 12 SPEC.ISS., 2003, Pages 1195-1201

  Joshi, Yogendra ^a   Azar, Kaveh ^b   Blackburn, David ^c   Lasance, Clemens J M ^d   Mahajan, Ravi ^e   Rantala, Jukka ^e  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Advanced Thermal Solution Inc   (United States)

^c NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^d PHILIPS RESEARCH LABORATORIES   (Netherlands)

^e INTEL CORPORATION   (United States)

Author keywords

Microelectronics and microsystems A T; Reliability; Thermal modeling

Indexed keywords

MACHINE DESIGN; MICROELECTRONICS; OPTIMIZATION; RELIABILITY; RISK ASSESSMENT; SPECIFICATIONS;

THERMAL MODELING;

THERMOANALYSIS;

EID: 0242574333     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(03)00200-3     Document Type: Conference Paper

References (3)

1. Lall P., Pecht M.G., Hakim E.B. Influence of Temperature on Microelectronic and System Reliability. 1997;CRC Press, West Palm Beach, FL, USA.
2. Klinger D.J., Nakada Y., Menendez M.A. AT and T Reliability Manual. 1990;Van Nostrand and Reinhold, New York.
3. C. Belady, Private communication, Hewlett-Packard Corporation, 2002.