Investigation of the bonding states of the SiO2 aerogel film/metal interface

Thin Solid Films

Volumn 447-448, Issue , 2004, Pages 575-579

  Jung, Sang Bae ^a   Park, Hyung Ho ^a   Kim, Haecheon ^b  

^a Yonsei University   (South Korea)

^b Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

Al; Copper silicate bond; Cu; Interface; Leakage current; Low dielectric; SiO2 aerogel film

Indexed keywords

AEROGELS; AGING OF MATERIALS; ALUMINUM; ANNEALING; BINDING ENERGY; CHEMICAL BONDS; COPPER; DRYING; INTERFACES (MATERIALS); LEAKAGE CURRENTS; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY; SOL-GELS; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER SILICATE BOND; LOW DIELECTRIC CONSTANT MATERIALS; SIO2 AEROGEL FILMS;

SILICA;

EID: 1342302423     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2003.07.019     Document Type: Conference Paper

References (18)

1. Mosig K., Jacobs T., Brennan K., Rasco M., Wolf J., Augur R. Microelectron. Eng. 64:2002;11.
2. Hrubesh L.W., Keene L.E., Latorre V.R. J. Mater. Res. 8:1993;1736.
3. Jung S.B., Park H.H. Thin Solid Films. 420-421:2002;503.
4. Jo M.H., Park H.H. Appl. Phys. Lett. 72:1998;1391.
5. Miller A.C., McCluskey F.P. J. Vac. Sci. Technol. A. 9:1991;1461.
6. Vasile M.J., Bachman B.J. J. Vac. Sci. Technol. A. 7:1989;2992.
7. Ding S.J., Zhang Q.Q., Zhang D.W., Wang J.T., Zhou Y.D., Lee W.W. Appl. Surf. Sci. 178:2001;140.
8. Renault O., Gosset L.G., Rouchon D., Ermolieff A. J. Vac. Sci. Technol. A. 20:2002;1867.
9. S. Massey, D. Roy, A. Adnot, Nucl. Instrum. Methods Phys. Res. Section B, in press.
10. Kundu M., Miyata N., Ichikawa M. J. Appl. Phys. 93:2003;1498.
11. Evans R.C. An Introduction to Crystal Chemistry. 2nd ed:1966;68 Cambridge University Press, New York.
12. Wong A.S.W., Krishnan R.G., Sarkar G. J. Vac. Sci. Technol. A. 18:2000;1619.
13. Kim Y.S., Shimogaki Y. J. Vac. Sci. Technol. A. 19:2001;2642.
14. Rajagopal A., Gregoire C., Lemaire J.J., Pireaux J.J., Baklanov M.R., Vanhaelemeersch S., Maex K., Waeterloos J.J. J. Vac. Sci. Technol. B. 17:1999;2336.
15. Galuska A.A. J. Vac. Sci. Technol. A. 10:1992;381.
16. Wu Y., Garfunkel E., Madey T.E. J. Vac. Sci. Technol. A. 14:1996;1662.
17. Peden C.H.F., Kidd K.B., Shinn N.D. J. Vac. Sci. Technol. A. 9:1991;1518.
18. Liu P.T., Chang T.C., Yang Y.L., Cheng Y.F., Shih F.Y., Lee J.K., Tsai E., Sze S.M. Jpn. J. Appl. Phys. 38:1999;6247.