Experimental Analysis of the Effect of Metal Thickness on the Quality Factor in Integrated Spiral Inductors for RF ICs

IEEE Electron Device Letters

Volumn 25, Issue 2, 2004, Pages 76-79

  Choi, Yun Seok ^a   Yoon, Jun Bo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Integrated micromachined inductor; Metal thickness; Micromachining; Q factor; Radio frequency (RF) ICs; Resistance; RF MEMS

Indexed keywords

COMPUTER SIMULATION; COPPER; ELECTRIC CONDUCTIVITY; ELECTRIC INDUCTORS; ELECTRIC RESISTANCE; FINITE ELEMENT METHOD; INDUCTANCE; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; Q FACTOR MEASUREMENT; SEMICONDUCTING SILICON; SURFACE PHENOMENA;

INTEGRATED MICROMACHINED INDUCTORS; METAL THICKNESS; Q-FACTOR; RADIO FREQUENCY (RF) ICS; RF MEMS;

INTEGRATED CIRCUITS;

EID: 1342286928     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2003.822652     Document Type: Article

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