Assembled micro-electromechanical-systems microcolumn from a single layer silicon process

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 6, 2004, Pages 3168-3173

  Saini, R ^a   Jandric, Z ^a   Tsui, K ^a   Udeshi, T ^a   Tuggle, D ^b  

^a ZYVEX CORPORATION   (United States)

^b PORTLAND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATED ASSEMBLY; FIELD OF VIEW (FOV); MICROCOLUMN ARRAYS; SCHOTTKY EMITTER;

ELECTRONS; LENSES; NATURAL FREQUENCIES; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DOPING; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

MICROELECTROMECHANICAL DEVICES;

EID: 13244278374     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1815311     Document Type: Conference Paper

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