Transient liquid phase diffusion bonding of 8090 Al-Li alloy using copper interlayer

Materials Science and Technology

Volumn 14, Issue 5, 1998, Pages 422-428

  Dunford, D V ^a   Partridge, P G ^a  

^a DEFENCE SCIENCE AND TECHNOLOGY LABORATORY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 1242268643     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/mst.1998.14.5.422     Document Type: Article

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