Control of topographical selectivity in palladium-activated electroless copper metallization

Electrochemical and Solid-State Letters

Volumn 8, Issue 1, 2005, Pages

  Oh, Youn Jin ^a   Cho, Sung Min ^a   Chung, Chan Hwa ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; CLEANING; COPPER; ELECTROLESS PLATING; IONIZATION; POLYETHYLENE GLYCOLS; SURFACE TOPOGRAPHY; ULSI CIRCUITS; X RAY PHOTOELECTRON SPECTROSCOPY;

BARRIER SURFACES; PALLADIUM ACTIVATION; TOPOGRAPHICAL SELECTIVITY; WATER RINSING;

METALLIZING;

EID: 12344307327     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1825291     Document Type: Article

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