Uniformity across 200 mm silicon wafers printed by nanoimprint lithography

Journal of Physics D: Applied Physics

Volumn 38, Issue 1, 2005, Pages 70-73

  Gourgon, C ^a   Perret, C ^a   Tallal, J ^a   Lazzarino, F ^a   Landis, S ^a   Joubert, O ^a   Pelzer, R ^b  

^a CEA LETI   (France)

^b CEA/LETI ^*  (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; DEGRADATION; ELECTRON BEAMS; LITHOGRAPHY; NANOTECHNOLOGY; PARAMETER ESTIMATION; PLASTIC FILMS; THERMAL EFFECTS;

ANTI-STICKING LAYERS; MULTI-LEVEL PROCESSES; NANOIMPRINT LITHOGRAPHY; PRESSURE RANGE;

SILICON WAFERS;

EID: 11844256987     PISSN: 00223727     EISSN: None     Source Type: Journal    
DOI: 10.1088/0022-3727/38/1/012     Document Type: Article

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