Emerging MOSFET packaging technologies and their thermal evaluation

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 1102-1108

  Fan, Xuejun ^a   Haque, Shatil ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

BGA; Flipchip; Micro lead frame; MOSFET packaging; Thermal modeling

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HEAT LOSSES; RELIABILITY; THERMOANALYSIS;

THERMAL EVALUATION;

MOSFET DEVICES;

EID: 0036455583     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

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