Structural characterisation of nickel suicide performed by two-dimensional X-ray microdiffraction

Materials Science and Engineering: B

Volumn 114-115, Issue SPEC. ISS., 2004, Pages 236-240

  Colombi, P ^a   Bontempi, E ^a   Meotto, U M ^b   Porro, S ^b   Ricciardi, C ^b   Scaltrito, L ^b   Ferrero, S ^b   Richieri, G ^c   Merlin, L ^c   Depero, L E ^a  

^a UNIVERSITY OF BRESCIA   (Italy)

^b POLITECNICO DI TORINO   (Italy)

^c Intl Rectifier Corporation Italia   (Italy)

Author keywords

Nickel silicide; Preferred orientation; X ray microdiffraction

Indexed keywords

CURRENT DENSITY; ELECTRIC CURRENTS; EVAPORATION; MICROSTRUCTURE; THIN FILMS; X RAY DIFFRACTION;

NICKEL SILICIDE; OHMIC BEHAVIOR; PREFERRED ORIENTATION; X-RAY MICRODIFFRACTION;

NICKEL COMPOUNDS;

EID: 10644284770     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2004.07.071     Document Type: Conference Paper

References (8)

1. P.G. Neudeck, SiC Technology, NASA Lewis Research Center, M.S. 77-1, 21000 Brookpark Road, Cleveland, OH 44135, USA, 1998.
2. F. Roccaforte, F. La Via, S. Di Franco, V. Raineri, Microelectron. Eng. 70 (2003) 524-528.
3. W. Lu, W.C. Mitchel, G.R. Landis, T.R. Crenshaw, W. Eugene Collins, Solid State Electron. 47 (2003) 2001-2010.
4. F. La Via, F. Roccaforte, A. Makhtari, V. Raineri, P. Musumeci, L. Calcagno, Microelectron. Eng. 60 (2002) 269-282.
5. E. Bontempi, M. Gelfi, L.E. Depero, in: R.M. Mohan (Ed.), Research Advances in Chemistry of Materials, Global Research Network Publications, 2003, p. 21.
6. Sang Youn Han, Ki Hong Kim, Jong Kyu Kim, Ho Won Jang, Kwang Ho Lee, Nam-Kyun Kim, Eun Dong Kim, Jong-Lam Lee, Appl. Phys. Lett. 79 (12) (2001) 1816-1818.
7. F. Roccaforte, F. La Via, V. Raineri, L. Calcagno, P. Musumeci, Appl. Surf. Sci. 184 (2001) 295-298.
8. J. Rinderknecht, H. Prinz, T. Kammler, N. Shell, E. Zschech, K. Wetzig, T. Gessner, Microelectron. Eng. 70 (2003) 226-232.