The flip-chip bump interconnection for millimeter-wave GaAs MMIC

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 47-52

  Kusamitsu, H ^a   Morishita, Y ^a   Maruhashi, K ^a   Ito, M ^a   Ohata, K ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM OXIDE; CHIP SCALE PACKAGES; EPOXY RESINS; GALLIUM ARSENIDE; III-V SEMICONDUCTORS; INTEGRATED CIRCUIT INTERCONNECTS; LOW NOISE AMPLIFIERS; MICROPROCESSOR CHIPS; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; PACKAGING; SCATTERING PARAMETERS; SEMICONDUCTING GALLIUM;

DC CHARACTERISTICS; ELECTRICAL PERFORMANCE; FLIP CHIP BUMPS; INTERCONNECTION METHOD; INTERCONNECTION RESISTANCE; INTERCONNECTION STRUCTURE; LOW-COST PACKAGING; TEMPERATURE CYCLES;

FLIP CHIP DEVICES;

EID: 84961744320     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670753     Document Type: Conference Paper

References (4)

1. Rich Sturdivant, "Reducing the effect of the Mounting Substrate on the Performance of GaAs MMIC Flip-chips" Proceedings of the 1995 IEEE MTT-S Digest, pp 1591-1594.
2. T. Krems, W. Heydi, et el., "Millimeter-wave Performance of Chip Interconnections using Wire bonding and Flip-chip." Proceedings of the 1996 IEEE MTT-S Digest, pp 247-250.
3. Y. Arai, M. Sato. et el., "60GHz Flip-chip Assembled MIC Design Considering Chip-Substrate Effect." Proceedings of the 1997 IEEE MTT-S Digest, pp 447-450.
4. Kei Tanaka, et el., "A Fine Pitch Lead-less-Chip Assembly Technology with the Build-up PCB" Proceedings of the 1996 ICEMCM Digest pp 369-374.