Double-layer no-flow underfill materials and process

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 404-410

  Zhang, Zhuqing ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILLERS; RELIABILITY THEORY; SOLDERED JOINTS; THERMAL EXPANSION; VISCOSITY; WETTING;

UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0036294760     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. Resin insertion effect on thermal cycle resistivity of flip-chip mounted LSI devices
2. Flip-chip solder bimp fatigue life enhanced by polymer encapsulation
3. Analysis of the flow of encapsulant during underfill encapsulation of flip-chips
4. High performance no-flow underfill for low-cost flip-chip applications: Material characterization
5. Recent advances in the development of no-flow underfill encapsulants - A practical approach towards the actual manufacturing application
6. Molded underfill for flip chip in package
7. Special characteristic of future flip chip underfill materials and the process
8. Development of the wafer level compressive-flow underfill process and its required materials
9. Material challenges for wafer level packaging
10. A novel approach for incorporating silica fillers into no-flow underfill