Simultaneously determining young's modulus, coefficient of thermal expansion, poisson ratio and thickness of thin films on silicon wafer

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 901-905

  Wu, Enboa ^a   Yang, Albert J D ^a   Shao, Ching An ^b  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b Department of Industrial Engineering and Management   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; GENETIC ALGORITHMS; POISSON RATIO; SILICON WAFERS; TENSILE TESTING; THERMAL EXPANSION; THICKNESS MEASUREMENT;

COEFFICIENT OF THERMAL EXPANSION; DIGITAL PHASE SHIFTED REFLECTION MOIRE (DPRM); MECHANICAL PARAMETERS; WARPAGE;

THIN FILMS;

EID: 10444268031     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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