Determination of mechanical properties of thin film on silicon wafer

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 203-208

  Wu, Enboa ^a   Yang, Albert J D ^a   Shao, Ching An ^b   Yen, C S ^c  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b Department of Industrial Engineering and Management   (Taiwan)

^c HWA HSIA INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; GENETIC ALGORITHMS; GREEN'S FUNCTION; INTERFEROMETRY; PHASE SHIFT; PLASTIC DEFORMATION; POISSON DISTRIBUTION; PROBLEM SOLVING; SPECKLE; SPUTTERING; THERMAL EXPANSION; THIN FILMS; X RAY DIFFRACTION;

COEFFICIENT OF THERMAL EXPANSION (CTE); DISLOCATION DENSITY;

SILICON WAFERS;

EID: 1942440412     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-55479     Document Type: Conference Paper

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