Reliability of an 1657CCGA (ceramic column grid array) package with 95.5Sn3.9Ag0.6Cu lead-free solder paste on PCBs (printed circuit boards)

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 229-238

  Lau, John ^a   Dauksher, Walter ^a  

^a AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CREEP; FATIGUE OF MATERIALS; HYSTERESIS; INTEGRATED CIRCUITS; RELIABILITY; SOLDERING; THERMAL CYCLING; WEIBULL DISTRIBUTION;

CERAMIC COLUMN GRID ARRAY; ENERGY DENSITY; SOLDER PASTES;

PRINTED CIRCUIT BOARDS;

EID: 1942536544     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-55041     Document Type: Conference Paper

References (20)

1. Cole, M., I. DeSousa, M. Interrante, J. Jozwiak, M. June, G Martin, C. Milkovich, J. Ross, and M. Shannon, "The New Millennium for CCGA - Beyond 2000 I/O", Proceedings of SMI, Chicago, IL, 2001, pp. 297-306.
2. Caulfield T., M. Cole, F. Cappo, J. Zitz, and J. Benenati, "An Overview of Ceramic Ball and Column Grid Array Packaging", in Ball Grid Array Technology, ediited by J. Lau, McGraw-Hill, New York, 1995, pp. 131-169.
3. Banks, D., K. Hoebener, and P. Viswanadham, "Ceramic Ball Grid Array Assembly", in Ball Grid Array Technology, ediited by J. Lau, McGraw-Hill, New York, 1995, pp. 171-192.
4. Master, R., M. Cole, and G. Martin, "Ceramic Column Grid Array for Flip Chip Applications" IEEE Proceedings of Electronic Components & Technology Conference, May 1995, pp. 925-929.
5. Ray, S., et.al., "Ceramic Column Grid Array for a High Performance Workstation Application", IEEE Proceedings of Electronic Components and Technology Conference, 1997, pp. 319-324.
6. Ray, S., et.al., CLASP Ceramic Column Grid Array Technology for Flip Chip Carriers", Proceedings of SEMICON West, 1999, pp. 1-7/99.
7. Interrante, M.J., et.al., "High Density Column Grid Array Connections and Method Thereof", US Patent No. 6,429,388, 2002.
8. Mann, N., R. Schafer, and N. Singpurwalla, Methods for Statistical Analysis of Reliability and Life Data, John Wiley & Sons, 1974.
9. Barlow, R. and F. Proschan, Statistical Theory of Reliability and Life Testing, Holt, Reinhart and Winston, 1974.
10. Little, R. and E. Jebe, Statistical Design of Fatigue Experiments, Applied Science Publishers, 1975.
11. Smetana, J., R. Horsley, J. Lau, K. Snowdon, D. Shangguan, J. Gleason, I. Memis, D. Love, W. Dauksher, and B. Sullivan, "Lead-Free Design, Materials, and Process of High Density Packages", Proceedings of APEX, Anaheim, CA, CD-ROM, March 2003.
12. Lau, J., W. Dauksher, J. Smetana, R. Horsley, D. Shangguan, T. Castello, I. Menis, D. Love, and B. Sullivan, "Design for Lead-Free Solder Joints reliability of High-Density Packages", Proceedings of APEX, Anaheim, CA, CD-ROM, March 2003.
13. Lau, J., N. Hoo, R. Horsley, J. Smetana, D. Shangguan, W. Dauksher, D. Love, I. Menis, and B. Sullivan, "Reliability Test and Data Analysis of High-Density Packages' Lead-Free Solder Joints", Proceedings of APEX, Anaheim, CA, CD-ROM, March 2003.Norris, K.C., and A. Landzberg, "Reliability of Controlled Collapse Interconnections", IBM Journal of Research and Development, Vol. 13, May 1969, pp. 534-544.
14. Lau, J., N. Hoo, R. Horsley, J. Smetana, D. Shangguan, W. Dauksher, D. Love, I. Menis, and B. Sullivan, "Reliability Test and Data Analysis of High-Density Packages' Lead-Free Solder Joints", Proceedings of APEX, Anaheim, CA, CD-ROM, March 2003.Norris, K.C., and A. Landzberg, "Reliability of Controlled Collapse Interconnections", IBM Journal of Research and Development, Vol. 13, May 1969, pp. 534-544.
15. Lau, J., D. Shangguan, T. Castello, R. Horsley, J. Smetana, W. Dauksher, D. Love, I. Menis, and B. Sullivan, "Failure Analysis of High-Density Packages' Lead-Free Solder Joints", Proceedings of APEX, Anaheim, CA, CD-ROM, March 2003. Lau, J. H., and D. Rice, "Solder Joint Fatigue in Surface Mount Technology - State of the Art", Solid State Technology, Vol. 28, October 1985, pp. 91-104.
16. Lau, J., D. Shangguan, T. Castello, R. Horsley, J. Smetana, W. Dauksher, D. Love, I. Menis, and B. Sullivan, "Failure Analysis of High-Density Packages' Lead-Free Solder Joints", Proceedings of APEX, Anaheim, CA, CD-ROM, March 2003. Lau, J. H., and D. Rice, "Solder Joint Fatigue in Surface Mount Technology - State of the Art", Solid State Technology, Vol. 28, October 1985, pp. 91-104.
17. ANSYS, User's Manual, Release 6.1, 2002.
18. Lau, J. H., W. Dauksher, and P. Vianco, "Acceleration Models, Constitutive Equations, and Reliability of Lead-Free Solders", IEEE Proceedings of Electronic Components & Technology Conference, May 2003, pp. 229-236.
19. Lau, J. H., and Y. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY, 1997.
20. Lau, J. H., Z. Mei, S. Pang, C. Amsden, J. Rayner, and S. Pan, "Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch", ASME Transactions, Journal of Electronic Packaging, Vol. 124, December 2002, pp. 403-410.