Ceramic column grid array (CCGA) module for a high performance work station application

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 319-324

  Ray, S K ^a   Quinones, H ^a   Iruvanti, S ^a   Atwood, E ^a   Walls, L ^a  

^a East Fishkill Animal Hospital   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINUM; FLIP CHIP DEVICES; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS;

CERAMIC COLUMN GRID ARRAY (CCGA) PACKAGE; PITCH SOLDER COLUMN GRID ARRAY;

ELECTRONICS PACKAGING;

EID: 0030705123     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)