Characterization of the curing properties of no-flow underfill and B-stage feasibility study for wafer level application

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 971-977

  Zhang, Zhuqing ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; CURING; FILLERS; FLIP CHIP DEVICES; GLASS TRANSITION; MATHEMATICAL MODELS; OPTIMIZATION; REACTION KINETICS; RELIABILITY; SILICON WAFERS; SOLDERED JOINTS; TEMPERATURE;

DICING; NANOINDENTOR; NO-FLOW UNDERFILL; REFLOW PROCESS; REFLOWABILITY;

CHIP SCALE PACKAGES;

EID: 0038688974     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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5. C.P. Wong, and S.H. Shi, "No-Flow Underfill of Epoxy Resins, Anhydride, and Fluxing Agent and Surfactant", US Patent 6,180,696, Jan. 30, 2001.
6. Z. Zhang, and C.P. Wong, "Study and Modeling of the Curing Behavior of No-Flow Underfill", Proceedings of the 52nd Electronic Components and Technologies Conference, pp. 432-438, San Diego, CA, (2002).
7. J.M. Hurley, T. Berfield, and S. Ye, "Kinetic Modeling of No-Flow Underfill Cure and Its Relationships to Solder Wetting and Voiding", Proceedings of the 52nd Electronic Components and Technologies Conference, pp. 828-833, San Diego, CA, (2002).
8. P. Morganelli, and B. Wheelock, "Viscosity of a no-flow underfill during reflow and its relationship to solder wetting", Proceedings of the 51st Electronic Components and Technology Conference, pp. 163-166, Orlando, FL, 2001.
9. S.H. Shi, and C.P. Wong, "Recent Advances in the Development of No-Flow Underfill Encapsulants - a Practical Approach towards the Actual Manufacturing Application", IEEE Transactions on CPMT, Part C: Electronics Packaging Manufacturing, Vol. 22(4), pp. 331, 1999.
10. S.H. Shi, T. Yamashita, and C.P. Wong, "Development of the Wafer-Level Compressive-Flow Underfill Process and Its Required Materials", IEEE Transactions on CPMT, Part C: Electronics Packaging Manufacturing, Vol. 22(4), pp. 274, 1999.
11. Z. Zhang, A. Vorakunpinij, S.K. Sitaraman, and C.P. Wong, "Time Evolution of Temperature Distribution of a Flip-Chip No-Flow Underfill Package During Solder Reflow Process", Proceedings of the 53rd Electronic Components and Technology Conference, accepted.