Viscoelastic properties of underfill for numerical analysis of flip chip packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 560-566

  Sham, Man Lung ^a   Kim, Jang Kyo ^a   Park, Joo Hyuk ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b Sejong University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; FLIP CHIP DEVICES; NUMERICAL METHODS; PRINTED CIRCUIT BOARDS; RELAXATION PROCESSES; RESIDUAL STRESSES; RESINS; THERMAL CYCLING; VISCOELASTICITY;

FLIP CHIP PACKAGE; NUMERICAL STRESS ANALYSIS; TIME-TEMPERATURE SUPERPOSITION TECHNIQUE;

ELECTRONICS PACKAGING;

EID: 0038682593     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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2. Park, J.H., Kim, J.K., Yuen, M.M.F., Lee, S.W.R., Tong, P. & Chan, P.C.H., "Thermal stress analysis of a PQFP moulding process: comparison of viscoelastic and elastic models" Key Eng. Mater., 145-149 (1998), pp.1127-1132.
3. Yeung, D.T.S. & Yuen, M.M.F., "Warpage of plastic IC packages as a function of processing conditions", J. Electron. Packag., Vol. 123, No. 3 (2001), pp.268-272.
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6. Billmeyer, F.R., Textbook of Polymer Science, 3rd Ed., John Wiley & Sons Pub., 1984.
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8. Huang, X., Lee, S.W.R., Yan, C.C. & Hui, S., "Characterization and Analysis on the Solder Ball Shear Testing Conditions," Proc 51st Electronic Components & Technology Conf, 2001, pp.1065-1071.
9. Yao, Q. & Qu, J., "Three-dimensional versus two-dimensional finite element modelling of flip-chip packages", J. Electron. Packag., Vol. 121 (1999), pp.196-201.
10. Sham, M.L. & Kim, J.K., "Curing behaviour and residual stresses in underfill resin" IEEE Trans. Comp. Package. Manuf. Technol. under review.
11. Sham, M.L. & Kim, J.K., "Experiment and numerical analysis of the residual stresses in underfill resins for flip chip package applications" J. Electronic Packaging, under review.