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High-impedance electromagnetic surfaces with a forbidden frequency band
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An investigation of PCB radiated emissions from simultaneous switching noise
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Seattle WA, USA, 2-6 Aug.
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Printed circuit board EMI source mechanisms
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Boston, MA, USA, 3-4 Aug.
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T.H Hubing, "Printed circuit board EMI source mechanisms," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Boston, MA, USA, 3-4 Aug. 2003, Vol. 1, pp. 1-3.
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The radiation of a rectangular power bus structure at multiple cavity-mode resonances
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M. Leone, "The radiation of a rectangular power bus structure at multiple cavity-mode resonances," IEEE Transactions on Electromagnetic Compatibility, Vol. 45, No. 3 (2003), pp. 486-492.
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A novel power plane with integrated simultaneous switching noise mitigation capability using high-impedance surface
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T. Kamgaing, O. M. Ramahi, "A Novel Power Plane with Integrated Simultaneous Switching Noise Mitigation Capability using High-Impedance Surface", IEEE Microwave and Wireless Components Letters, Vol. 13, No. 1 (2003), pp. 21-23.
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Kamgaing, T.1
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Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure
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Seattle, WA, June 2-7
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R. Abhari, and G.V. Eleftheriades "Suppression of the Parallel-Plate Noise in High-Speed Circuits Using a Metallic Electromagnetic Band-Gap Structure," 2002 IEEE MTT-S International Microwave Symposium, Seattle, WA, June 2-7, 2002, pp. 493-496.
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2002 IEEE MTT-S International Microwave Symposium
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Abhari, R.1
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Power-supply decoupling on fully populated high-speed digital PCBs
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Designing power bus decoupling for CMOS devices
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Denver, CO, USA, 23-28 August
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S. Radu, R. E. DuBroff, J. L. Drewniak, T. H. Hubing, and T. P. VanDoren, "Designing power bus decoupling for CMOS devices," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, USA, 23-28 August 1998, pp. 375-380.
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10
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0038181363
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Modeling printed circuit boards with embedded decoupling capacitance
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Montreal, Canada, 13-17 Aug.
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M. Xu, T. H. Hubing, J. Drewniak, T. VanDoren, and R. DuBroff, "Modeling printed circuit boards with embedded decoupling capacitance," Proceedings of IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, 13-17 Aug. 2001, pp. 515-520.
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Reducing simultaneous swithing noise and EMI on ground/power planes by dissipative edge termination
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I. Novak, "Reducing Simultaneous Swithing Noise and EMI on Ground/Power Planes by Dissipative Edge Termination," IEEE Transactions on Advanced Packaging, Vol. 22, No. 3 (1999), pp. 274-282
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Novak, I.1
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Reducing power bus impedance at resonance with lossy components
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T.M. Zeeff, T.H. Hubing, "Reducing power bus impedance at resonance with lossy components," IEEE Transactions on Advanced Packaging, Vol. 25, No. 2 (2002), pp. 30-310.
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Zeeff, T.M.1
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Power bus noise reduction using power islands in printed circuit board designs
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Seattle, WA, USA, 2-6 Aug.
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T. Hubing, J. Chen, J. Drewniak, T. Van Doren, Y. Ren, J. Fan, R. DuBroff, R., "Power bus noise reduction using power islands in printed circuit board designs," Proceedings of IEEE International Symposium on Electromagnetic Compatibility, Seattle, WA, USA, 2-6 Aug. 1999, pp. 1-4.
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Proceedings of IEEE International Symposium on Electromagnetic Compatibility
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Hubing, T.1
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0035519098
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EMI mitigation with multilayer power bus stacks and via stitching of reference planes
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X. Yee, D. M. Hockanson, M. Li, Y. Ren, W. Cui, J. L. Drewniak, and R. E. DuBroff, "EMI mitigation with multilayer power bus stacks and via stitching of reference planes," IEEE Transactions on Electromagnetic Compatibility, Vol. 43 (2001), pp. 538-548.
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10444253451
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Mitigating multi-layer PCB power bus radiation through novel mesh fencing techniques
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Princeton, NJ, USA, 27-29 Oct.
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X. Wu, M. H. Kermani, and O. M. Ramahi, "Mitigating Multi-layer PCB Power Bus Radiation through Novel Mesh Fencing Techniques," Proceedings of Topical Meeting on Electrical Performance of Electronic Packaging, Princeton, NJ, USA, 27-29 Oct. 2003, pp. 207-210.
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Proceedings of Topical Meeting on Electrical Performance of Electronic Packaging
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Wu, X.1
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0033681036
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The EMI benefits of ground plane stitching in multi-layer power bus stacks
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Washington, DC, USA, 21-25 Aug.
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X. Ye, D. M. Hockanson, M. Li; W. Cui, S. Radu, J.L. Drewniak, T.P. VanDoren, T.H. Hubing, R. E. DuBroff, "The EMI benefits of ground plane stitching in multi-layer power bus stacks," Proceedings of IEEE International Symposium on Electromagnetic Compatibility, Washington, DC, USA, 21-25 Aug. 2000, Vol. 2, pp. 833-838.
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Ye, X.1
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VanDoren, T.P.7
Hubing, T.H.8
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19
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0041970200
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In-phase reflection and EM wave suppression characteristics of electromagnetic band gap ground planes
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Columbus, Ohio, USA, 22-27 June
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A. Aminian, F. Yang, Y. Rahmat-Samii, "In-phase reflection and EM wave suppression characteristics of electromagnetic band gap ground planes," Proc. of IEEE Antennas and Propagation Society International Symposium, Columbus, Ohio, USA, 22-27 June 2003, Vol. 4, pp. 430-433.
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10444255836
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Design considerations for high-impedance surfaces embedded in printed circuit boards
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Syracuse, NY, USA, 19-23 April, to appear
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S. Shahparnia, O. M. Ramahi and B. Archambeault, "Design considerations for high-impedance surfaces embedded in printed circuit boards" Proceedings of the Applied Computational Electromagnetics Society Conference (ACES 2004), Syracuse, NY, USA, 19-23 April, 2004, to appear.
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Proceedings of the Applied Computational Electromagnetics Society Conference (ACES 2004)
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Shahparnia, S.1
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Ultra wide-band electromagnetic interference (EMI) reduction from printed circuit boards (PCB)
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Syracuse, NY, USA, 19-23 April, to appear
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S. Shahparnia, O. M. Ramahi, "Ultra wide-band electromagnetic interference (EMI) reduction from printed circuit boards (PCB)," Proceedings of the 2004 Applied Computational Electromagnetics Society Conference (ACES 2004), Syracuse, NY, USA, 19-23 April, 2004, to appear.
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Proceedings of the 2004 Applied Computational Electromagnetics Society Conference (ACES 2004)
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Shahparnia, S.1
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Eliminating surface currents with metallodielectric photonic crystals
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Baltimore, MD, USA, 7-12 June
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D. Sievenpiper, D., E. Yablonovitch, "Eliminating surface currents with metallodielectric photonic crystals," Proceedings of IEEE MTT-S International Microwave Symposium, Baltimore, MD, USA, 7-12 June 1998, Vol. 2, pp. 663-666.
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