EMI benefits of ground plane stitching in multi-layer power bus stacks

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2, Issue , 2000, Pages 833-838

  Ye, Xiaoning ^a   Hockanson, David M ^a   Li, Min ^a   Cui, Wei ^a   Radu, Sergiu ^a   Drewniak, James L ^a   VanDoren, Thomas P ^a   Hubing, Todd H ^a   DuBroff, Richard E ^a  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC NETWORK ANALYSIS; ELECTROMAGNETIC WAVE INTERFERENCE; FINITE DIFFERENCE METHOD; MATHEMATICAL MODELS; TIME DOMAIN ANALYSIS;

GROUND PLANE STITCHING; POWER BUS STACKS;

PRINTED CIRCUIT BOARDS;

EID: 0033681036     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)