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Volumn 464, Issue 2, 1999, Pages 245-251
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New approach to metal electrodeposition at a periodically changing rate. Part I. The reversing overpotential method
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Author keywords
[No Author keywords available]
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Indexed keywords
ANODIC POLARIZATION;
COPPER PLATING;
CURRENT DENSITY;
MORPHOLOGY;
EXCHANGE CURRENT DENSITY;
REVERSING OVERPOTENTIAL METHOD;
ELECTROPLATING;
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EID: 0032652074
PISSN: 00220728
EISSN: None
Source Type: Journal
DOI: 10.1016/S0022-0728(99)00040-6 Document Type: Article |
Times cited : (8)
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References (10)
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