The role of microstructure in the electrical and thermal conductivity of Ni-alloys for LIGA microsystems

Microsystem Technologies

Volumn 10, Issue 6-7, 2004, Pages 510-516

  Graham, S ^a   Kelley, J ^a   Yang, N ^a   Borca Tasciuc, T ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ALLOYING; FREE ENERGY; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; THERMAL CONDUCTIVITY;

ENERGY TRANSPORT; ISOTHERMAL ANNEALING; METALLIC ALLOYING ADDITIVES;

NICKEL ALLOYS;

EID: 10044289707     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0383-6     Document Type: Conference Paper

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