Effect of bath temperature on microstructure of sulfamate nickel electrodeposits

Materials Transactions, JIM

Volumn 41, Issue 7, 2000, Pages 777-782

  Lin, Chao Sung ^a   Peng, Kun Cheng ^b   Hsu, Pei Cheng ^a   Chang, Liuwen ^c   Chen, Chih Hsiung ^c  

^a DA YEH UNIVERSITY   (Taiwan)

^b MING CHI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^c CHINA STEEL CORPORATION   (Taiwan)

Author keywords

Bath temperature; Columnar grain; Electrodeposition; Nickel sulfamate; Texture; Transmission electron microscopy

Indexed keywords

CRYSTAL GROWTH; CRYSTAL LATTICES; CRYSTAL MICROSTRUCTURE; CRYSTALLIZATION; DISLOCATIONS (CRYSTALS); ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; HARDNESS; TEXTURES; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

COLUMNAR GRAIN STRUCTURE; ELECTROCRYSTALLIZATION; LATTICE DEFECTS; OPTICAL METALLOGRAPHY; SULFAMATE NICKEL;

NICKEL ALLOYS;

EID: 0034215783     PISSN: 09161821     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans1989.41.777     Document Type: Article

References (24)

1. nd, American Electroplaters and Surface Finishing Society, Florida, (1986), pp. 253-315.
2. D. J. Evans: Trans. Faraday Soc., 54 (1958), 1086-1091.
3. B. C. Banerjee and A. Goswami: J. Electrochem. Soc., 106 (1959), 590-592.
4. R. Weil and R. Paquin: J. Electrochem. Soc., 107 (1960), 87-91.
5. R. Weil and H. C. Cook: J. Electrochem. Soc., 109 (1962), 295-301.
6. E. J. Suoninen and T. Hakkarainen: J. Mater. Sci., 3 (1968), 446-448.
7. J. Amblard, M. Froment, G. Maurin, N. Spyrellis and E. Trevisan-Souteyrand: Electrochimica Acta, 28 (1983), 909-915.
8. J. Amblard, I. Epelboin, M. Froment and G. Maurin: J. Appl. Electrochem., 9 (1979), 233-242.
9. G. C. Ye and D. N. Lee: Plat. & Surf. Fin., 68 (April 1981), 60-64.
10. D. N. Lee and G. C. Ye: Plat. & Surf. Fin., 68 (Nov. 1981), 46-50.
11. C. C. Hu, C. Y. Lin and T. C. Wen: Mater. Chem. Phys., 44 (1996), 233-238.
12. S. K. Verma and H. Wilman: J. Phys. D: Appl. Phys., 4 (1971), 2051-2065.
13. B. E. Jacobson and J. W. Sliwa: Plat. & Surf. Fin., 66 (Sep. 1979), 42-47.
14. J. W. Dini and H. R. Johnson: Thin Solid Films, 54 (1978), 183-188.
15. S. Kaja, H. W. Pickering and W. R. Bitler: Plat. & Surf. Fin., 73 (Jan. 1986), 58-61.
16. V. B. Singh and R. S. Sarabi: Mater. Sci. Tech., 11 (1995), 317-321.
17. D. Baudrand: Metal Finishing, 94 (July 1996), 15-18.
18. V. B. Singh and R. S. Sarabi: Plat. & Surf. Fin., 83 (Oct. 1996), 54-57.
19. S. W. Banovic, K. Barmak and A. R. Marder: J. Mater. Sci., 33 (1998), 639-645.
20. G. A. Di Bari: Nickel Plating, vol. 5, ASM Materials Handbook, (1994), pp. 201-212.
21. G. I. Finch, H. Wilman and L. Yang: Discussion Faraday Soc., 1 (1947), 144-158.
22. H. Fischer: Electrodep. Surf. Treat., 1 (1972/73), 239-251.
23. H. Fischer: Electrodep. Surf. Treat., 1 (1972/73), 319-337.
24. st, Noyes Publications, New Jersey, (1993), pp. 141-146.