Full 26GHZ MMIC chipset for telecom applications in SMD-type packages

2002 32nd European Microwave Conference, EuMC 2002

Volumn , Issue , 2002, Pages

  Beilenhoff, Klaus ^a   Quentin, Pierre ^a   Tranchant, Sylvie ^a   Vaudescal, Olivier ^a   Parisot, Marc ^a   Daembkes, Heinrich ^a  

^a United Monolithic Semiconductors GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIPSET; MODULE ASSEMBLIES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMIC); RF MODULE; TELECOM APPLICATIONS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 84897491249     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.2002.339234     Document Type: Conference Paper

References (5)

1. K. Beilenhoff, B. Adelseck, M. Oppermann, P. Quentin, M. Camiade and H. Daembkes, "Advanced MMIC Design for Significant Reduction of RF Module Cost", GAAS 2001, London, Conference Proceedings, pp. 495-497.
2. HEI Broadband, "A DC to 50GHz and Beyond MMIC Carrier", Micowave Journal, September 2001, pp. 236-239.
3. Allan Callander, River Huang, "Applications and Technology for Low-Cost MMIC Chip Carriers", International Microwave Symposium, Seattle 2002, Workshop WSB, Workshop Notes.
4. United Monolithic Semiconductors, Datasheets of CHA2069RAF and CHA5093TCF, available at www.ums-gaas.com.
5. United Monolithic Semiconductors, "Low-cost millimeter-wave packaged MMICs", Micowave Journal, June 2002, pp. 100-106.