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Japanese Journal of Applied Physics, Part 2: Letters

Volumn 42, Issue 12 A, 2003, Pages

Direct observation of electromigration and induced stress in Cu nanowire

(3) Fujisawa, Satoru a Kikkawa, Takamaro a,b Kizuka, Tokushi c

a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST (Japan)

b HIROSHIMA UNIVERSITY (Japan)

c UNIVERSITY OF TSUKUBA (Japan)

Author keywords

Annealing; Cu; Electromigration; Nanowire; Stress

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; COMPUTER SIMULATION; COPPER; CRYSTAL LATTICES; ELECTRIC WIRE; MOLECULAR DYNAMICS; NANOTECHNOLOGY; SINGLE CRYSTALS; STRAIN MEASUREMENT; STRESSES; TRANSMISSION ELECTRON MICROSCOPY;

ANODE ELECTRODE; MOLECULAR DYNAMICS SIMULATION; NANOWIRE; PULLING STRESS;

ELECTROMIGRATION;

EID: 0742321230 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.42.l1433 Document Type: Letter

Times cited : (21)

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