Design for Control: Temperature Uniformity in Rapid Thermal Processor

Korean Journal of Chemical Engineering

Volumn 17, Issue 1, 2000, Pages 111-117

  Huang, Ian ^a   Liu, Hsin Heng ^a   Yu, Cheng Ching ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Design for Control; Rapid Thermal Processor; Temperature Control; Temperature Uniformity; Thermal Stress Analysis

Indexed keywords

EID: 0347937366     PISSN: 02561115     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02789263     Document Type: Article

References (20)

1. Apte, P. P. and Saraswat, K. C., "Rapid Thermal Processing Uniformity Using Multi variable Control of a Circularly Symmetric 3 Zone Lamp," IEEE Trans. Semicond. Manuf., 5, 180 (1992).
2. Badgwell, T. A., Breedijk, T., Bushman, S. G., Butler, S. W., Chatterjee, S., Edgar, T. F., Toprac, A. J. and Trachtenberg, I., "Modeling and Control of Microelectronics Materials Processing," Computers Chem. Engng., 19, 1 (1995).
3. Cho, Y. M. and Kailath, T., "Model Identification in Rapid Thermal Processing System," IEEE Trans. Semicond Manuf., 6, 233 (1993).
4. Crowley, J. L., DeBolski, T. J., Kermani, A. and Lassing, S. E., US Patent 4,755,654 (5 July 1988).
5. Dilhac, J. M., Nolhier, N., Ganibal, C. and Zanchi, C., "Thermal Modeling of a Wafer in a Rapid Thermal Processor," IEEE Trans. Semicond. Manuf., 8, 432 (1995).
6. Fan, Y. H. and Qiu, T., "Analyses of Thermal Stress and Control Schemes for Fast Temperature Ramps of Batch Furnaces," IEEE Trans. Semiconduct. Manuf., 10, 433 (1997).
7. Gyurcsik, R. S., Riley, T. J. and Sorrell, F. Y., "A Model for Rapid Thermal Processing: Achieving Uniformity Through Lamp Control," IEEE Trans. Semicond. Manuf., 4, 9 (1991).
8. Huang, C. J., Yu, C. C. and Shen, S. H., "Identification and Nonlinear Control for Rapid Thermal Processor," IEEE Trans. Semiconduct. Manuf. (revised) (1999).
9. Huang, C. J., Yu, C. C. and Shen, S. H., "Selection of Measurement Locations for the Control of Rapid Thermal Processor," Automatica (in press) (2000).
10. Huang, I., "Control of Rapid Thermal Processor Design for Temperature Uniformity" MS Thesis, National Taiwan University of Sci. Technol., Taipei (1997).
11. Hebb, J. P. and Jensen, K. F., "The Effect of Multilayer Patterns on Thermal Stress During Rapid Thermal Processing of Silicon Wafers," IEEE Trans. Semiconduct. Manuf., 11, 99 (1998).
12. Lord, H. A., "Thermal and Stress Analysis of Semiconductor Wafer in a Rapid Thermal Processing Oven," IEEE Trans. Semicond. Manuf., 1, 105 (1988).
13. Merchant, T. P., Cole, J. V., Knutson, K. L., Hebb, J. P. and Jensen, K. F., "A Systematic Approach to Simulating Rapid Thermal Processing Systems," J. Electrochem. Soc., 143, 2035 (1996).
14. Morari, M. and Zafiriou, E., "Robust Process Control," Prentice-Hall, Englewood Cliff, NJ (1989).
15. National Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose, CA, Dec. (1994).
16. Norman, S. A., "Optimization of Wafer Temperature Uniformity in Rapid Thermal Processing System," IEEE Trans. Electron. Dev., 39, 205 (1992).
17. Roozeboom, F., "Manufacturing Equipment Issues in Rapid Thermal Processing," Academic Press, New York (1992).
18. Sachs, E., Guo, R., Ha, S. and Hu, A., "Process Control System for VLSI Fabrication," IEEE Trans. Semicond. Manuf., 4, 134 (1991).
19. Sorrell, F. Y., Harris, J. A. and Gyurcsik, R. S., "A Globel Model for Rapid Thermal Processors," IEEE Trans. Semicond. Manuf., 3, 183 (1990).
20. Stuber, J. D., Trachtenberg, I. and Edgar, T. F., "Desing and Modeling of Rapid Thermal Processing Systems," IEEE Trans. Semicond. Manuf., 11, 442 (1998).