Development of solder replacement conductive adhesives with stable resistance and superior impact performance

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 110-116

  Lu, Daoqiang ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Additives; Aging; Conductive adhesives; Contact resistance; Humidity; Lead; Moisture; Resins; Temperature; Tin

Indexed keywords

ADDITIVES; ADHESIVES; AGING OF MATERIALS; ATMOSPHERIC HUMIDITY; COATINGS; CONTACT RESISTANCE; CORROSION; CORROSION INHIBITORS; ELECTRONICS PACKAGING; IMPACT STRENGTH; JOINING; LEAD; MANUFACTURE; MOISTURE; POLYURETHANES; RESINS; RUBBER; SCAVENGING; SOLDERING ALLOYS; SYNTHETIC RESINS; TEMPERATURE; TIN;

CONDUCTIVE ADHESIVE; CONTACT RESISTANCE STABILITY; DYNAMIC MECHANICAL ANALYZER; ELECTRICALLY CONDUCTIVE ADHESIVES; ENVIRONMENTALLY FRIENDLY ALTERNATIVES; EPOXIDE-TERMINATED POLYURETHANE; PACKAGING APPLICATIONS; RUBBER-MODIFIED EPOXY RESINS;

EPOXY RESINS;

EID: 0347928910     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860582     Document Type: Conference Paper

References (22)

1. N. Kpppman, Microelectronics Packaging Handbook, R. Tummala, Ed., New York: Van Norstrand Reinhold, 1989, p.361.
2. B.T. Alpert and A.J. Schoenberg, "Conductive Adhesives as a Soldering Alternative," Electronic Packaging and Production, 1991, pp.130-132.
3. S.K. Kang, R.S. Rai, and S. Purushothaman, "Development of High Conductivity Lead (Pb)-free Conducting Adhesives," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 1, 1998, pp.18-22.
4. J. Hwang, Solder Joint Reliability, J. Lau, Ed., New Yrok: Van Nostrand Reinhold, 1991, p. 38.
5. B. Trumble, "Get the Lead Out," IEEE Spectrum, May 1998, pp.55-60.
6. S.K.Kang and A. Sarkel, "Lead (Pb)-free Solders for Electronic Packaging," Journal of Electronic Materials, Vol. 23, 1994, pp.701.
7. K. Gilleo, "Evaluating Polymer Solders for Pb-free Assembly," Circuits Assembly, Jan. 1994, p. 52;
8. D.J. Small, B. Eisenach, A. Lewis, and A. Babiarz, "Electrically Conductive Adhesives as an Alternative to Solder," Advanced Packaging, Jan, 1999, pp.38-42.
9. S. Corbett and M.J. Domiano, "Processing with Polymer Solders," Surface Mount Technology, June 1997, pp.48-52.
10. J. C. Jagt, P.J.M. Beric and G.F.C.M. Lijten, "Electrically Conductive Adhesives: A Prospective Alternative for SMD Soldering?," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B. Vol. 18, No. 2 (1995), pp. 292-298.
11. nd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, Sweden, June 3-5,1996, pp. 333-340.
12. th Electronic Components and Technology Conference, 1999, pp. 342-346.
13. th Electronic Components and Technology Conference, 1999, pp. 347-352.
14. J.C. Jagt, "Reliability of Electrically Conductive Adhesive Joint for Surface Mount Applications: A Summary of the State of the Art," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 2 (1998), pp. 215-225.
15. S. Macathy, Proceedings of Surface Mount International, San Jose, USA, August 27-31, 1995, pp.562-567.
16. th International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties and Interfaces, Braselton, GA, March 14-16, 1998, pp. 261-267.
17. nd International Symposium on Electronics Packaging Technology, Dec. 9-12, 1996, pp. 313-319.
18. H. Leidheiser, Jr., "Mechanism of Corrosion Inhibition with Special Attention to Inhibitor in Organic Coatings," Journal of Coating Technology, Vol. 53, No. 678, 1981, pp.29-39.
19. M.G. Noack, "Oxygen Scavengers," Corrosion'89, New Orleans, Louisiana, April 17-21, 1989, Paper no. 436.
20. G. Trabanelli and V. Carassiti, "Mechanism and Phenomenology of Organic Inhibitors," Advanced Corrosion Science and Technology, Ed. M.G. Fontana and R.W. Staehle, Vol. 1, Plenum Press, New York, NY, 1970, pp. 147-229.
21. nd International IEEE Symposium on Polymeric Electronics Packaging, 1999, pp.27-34.
22. D. Lu and C.P. Wong, "Novel Epoxide-modified Polyurethane Resins," US Patent, Filed in September 1999.