Thermal phenomena in compact electronic enclosures: A numerical study

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 3, 1997, Pages 286-294

  Maudgal, Vinod K ^a  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

Electronic enclosure; Natural convection; Numerical simulations; Temperature

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; ELECTRIC LOSSES; FINITE VOLUME METHOD; NATURAL CONVECTION; THERMAL CONDUCTIVITY OF SOLIDS;

COMPACT ELECTRONIC ENCLOSURES;

ELECTRONICS PACKAGING;

EID: 0031237619     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.623023     Document Type: Article

References (6)

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2. V. Maudgal, "Thermal modeling of densely packed electronic systems," in Proc. 12th IEEE Semi-Therm Symp., Austin, TX, Mar. 5-7, 1996, pp. 97-104.
3. D. Montgomery, Design and Analysis of Experiments. New York: Wiley, 1984.
4. E. Papanicolaou and Gopalakrishna, "Natural convection in shallow, horizontal air layers encountered in electronic cooling," Adv. Electron. Packag., ASME, vol. EEP-4-2, pp. 779-791, 1993.
5. S. V. Patankar, Numerical Heat Transfer and Fluid Flow. New York: McGraw-Hill, 1980.
6. G. D. Raithby and H. H. Wong, "Heat transfer by natural convection across vertical air layers," Numer. Heat Transfer, vol. 4, pp. 447-457, 1981.