Natural convection air cooling of a discrete heat source on a conducting board in a shallow horizontal enclosure

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 1, 1998, Pages 89-97

  Ortega, A ^a   Lall, B S ^a  

^a University of Arizona   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CORRELATION METHODS; HEAT TRANSFER COEFFICIENTS; NATURAL CONVECTION;

DISCRETE HEAT SOURCES;

ELECTRONICS PACKAGING;

EID: 0032023268     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792291     Document Type: Article

References (25)

1. Ai-Arabi, M., and El-Riedy, M. K., 1976, “Natural Convection Heat Transfer From Isothermal Plates of Different Shapes,” Inti J. Heat and Mass Transfer, Vol. 19, pp. 1399-1404.
2. Buller, M. L., and Duelos, T. G., 1982, “Thermal Characteristics of Horizontally Oriented Electronic Components in an Enclosed Environment,” Proc. Electronic Components Conference, pp. 153-157.
3. Ellison, G. N., 1989, Thermal Computations for Electronic Equipment, Robert E. Krieger Publishing Co., Malabar, FI.
4. Fishenden, M., and Saunders, O. A., 1957, An Introduction to Heat Transfer, Clarendon Press, London, p. 89.
5. Gebhart, B., Jaluria, Y., Mahajan, R. L., and Sammakia, B., 1988, Buoyancy Induced Flows and Transport, Hemisphere Pub. Corp., Washington, DC.
6. Globe, S., and Dropkin, D., 1959, “Natural Convection Heat Transfer in Liquids Confined Between Two Horizontal Plates,” ASME Journal of Heat Transfer, Vol. 81C, pp. 24-28.
7. Goldstein, R. J. and Chu, T. Y., 1969, “Thermal Convection in a Horizontal Layer of Air,” Prog. Heat Mass Transfer, Vol. 2, pp. 55-75.
8. Goldstein, R. J., Sparrow, E. M., and Jones, D. C., 1973, “Natural Convection Mass Transfer Adjacent to Horizontal Plates,” Int. J. Heat Mass Transfer, Vol. 116, p. 1025.
9. Goldstein, R. J., Chiang, H. D. and See, D. L., 1990, “High Rayleigh Number Convection in a Horizontal Enclosure,” J. Fluid Mech., Vol 213, pp. 111-126.
10. Hanneman, R. E., 1994, “Thermal Management in Electronics: The Next Ten Years,” invited lecture, IEEE Semiconductor Thermal Measurement and Management Symposium, SEMITHERM X, February 1994.
11. Hollands, K. G. T., Raithby, G. D., and Konicek, L., 1975, “Correlation Equations for Free Convection Heat Transfer in Horizontal Layers of Air and Water,” Int. J. Heat Mass Transfer, Vol. 18, pp. 879-884.
12. Husar, R. J. and Sparrow, E. M., 1968, “Patterns of Free Convection Adjacent to Horizontal Heated Surfaces,” Int. J. Heat Mass Transfer, Vol. 11, pp. 1206-1208.
13. Hybrid Thermal Modeller, 1996, Pacific Numerix Corporation, Scottsdale, AZ.
14. Incropera, F. P., and DeWitt, D. P., 1990, Introduction to Heat Transfer, John Wiley & Sons, pp. 517-525.
15. Kitamura, K., and Kimura, F., 1995, “Heat Transfer and Fluid Flow of Natural Convection Adjacent to Upward-Facing Horizontal Plates,” Int. J. Heat Mass Transfer, Vol. 38, No. 17, pp. 3149-3159.
16. Krane, R. J. and Phillips, T. J., 1986, “Natural Convection Cooling of a Hori-zontaily-Oriented Component Board in a Low-Aspect Ratio Enclosure,” Heat Transfer in Electronic Equipment, 1986, ASME HTD-Vol. 57, pp. 113-122.
17. Lall, B. S., Ortega, A. and Kabir, H., 1994, “Thermal Design Rules for Electronic Components on Conducting Boards in Passively Cooled Enclosures,” Proc. IEEE Intersociety Conference on Thermal Phenomena in Electronic Systems, ITHERM 94, Piscataway, NJ.
18. Lall, B. S., 1998, “Natural Convection Heat Transfer from Discrete Heat Sources on a Conducting Board in a Shallow Enclosure,” Ph.D. thesis, Dept, of Aero, and Mech. Eng., University of Arizona, Tucson, AZ.
19. Lasance, C. J. M., 1994, “Accurate Temperature Prediction in Consumer Electronics: A Must but Still a Myth,” in Cooling of Electronic Systems, S. Kakac, and H. Yuncu, eds., Kluwer Academic Publishers Group, Boston, MA, pp. 859-898.
20. Lloyd, J. R., and Moran, W. R., 1974, ‘Natural Convection Adjacent to Horizontal Surfaces of Various Planforms,” ASME Paper 74WA/HT-66.
21. McAdams, W. H., 1954, Heat Transmission, 3rd ed., chpt. 7, McGraw-Hill, NY.
22. Moffat, R. J., 1988, “Describing the Uncertainties in Experimental Results,” Exptl. Thermal Fluid Set, Vol. 1, pp. 3-17.
23. Myrum, T. A., 1990, “Natural Convection from a Heat Source in a Top-Vented Enclosure,” ASME Journal of Heat Transfer, Vol. 112, pp. 632-639.
24. Torrance, K. E., Orleff, L., and Rockett, J. A., 1969a, “Experiments on Natural Convection in Enclosures With Localized Heating from Below,” J. Fluid Mech., Vol. 36, Part 1, pp. 21-31.
25. Torrance, K. E., and Rockett, J. A., 1969b, “Numerical Study of Natural Convection in an Enclosure with Localized Heating From Below—Creeping Flow to the Onset of Laminar Stability,” J. Fluid Mech, Vol. 36, Part 1, pp. 33-54.