Natural convection air cooling of electronic components in partially open compact horizontal enclosures

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 51-57

  Yu, Enchao ^a   Joshi, Yogendra K ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; FLOW VISUALIZATION; HEAT CONDUCTION; HEAT RADIATION; NATURAL CONVECTION; TEMPERATURE MEASUREMENT;

AIR COOLING OF ELECTRONICS; COMPACT ENCLOSURE; PARTIALLY OPEN ENCLOSURE;

ELECTRONICS PACKAGING;

EID: 0031636579     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)