Dynamics of backside wafer level microprobing

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1998, Pages 137-149

  Chiang, Ching Lang ^a   Hurley, Daniel T ^a  

^a Hypervision Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; INTEGRATED CIRCUITS; MICROSCOPIC EXAMINATION; POLISHING; SILICON WAFERS;

BACKSIDE WAFER LEVEL MICROPROBING; DIE THINNING; EMISSION MICROSCOPY; ULTRALOW FORCE PROBE CARDS;

ELECTRIC NETWORK ANALYSIS;

EID: 0031676542     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/relphy.1998.670465     Document Type: Conference Paper

References (27)