Investigation of Multi-Level Metallization ULSls by Light Emission from the Back-Side and Front-Side of the Chip

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 1997-October, Issue , 1997, Pages 145-151

  Naitoh, Kensaku ^a   Ishii, T ^b   Mltsuhashi, J I ^b  

^a Tada electric Corporation   (Japan)

^b MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; LIGHT EMISSION; METALLIZING;

ASIC DEVICE; CHIP PACKAGES; EMISSION MICROSCOPY; FAILURE MECHANISM; INFRARED LIGHT; METALLISATION; MULTILEVELS; ON CHIPS; PHOTON COUNTING; WAVELENGTH SPECTRA;

FAILURE (MECHANICAL);

EID: 0345041383     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa1997p0145     Document Type: Conference Paper

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