Analytical heat flow modeling of silicon-on-insulator devices

Solid-State Electronics

Volumn 48, Issue 3, 2004, Pages 415-426

  Cheng, Ming C ^a   Yu, Feixia ^a   Habitz, Peter ^b   Ahmadi, Goodarz ^a  

^a Clarkson University   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

Characteristic thermal length; Self heating; SOI thermal model; SOI thermal resistance

Indexed keywords

ELECTROMIGRATION; HEAT EXCHANGERS; HEAT LOSSES; HEAT RESISTANCE; TEMPERATURE DISTRIBUTION;

HEAT FLOW MODELING;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0344898414     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sse.2003.08.007     Document Type: Article

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