Reduction of the thermal impedance of vertical-cavity surface-emitting lasers after integration with copper substrates

Applied Physics Letters

Volumn 69, Issue 4, 1996, Pages 463-464

  Mathine, D L ^a   Nejad, H ^a   Allee, D R ^a   Droopad, R ^b   Maracas, G N ^b  

^a Arizona State University   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COPPER; ELECTRIC IMPEDANCE; HEAT TRANSFER; MOLECULAR BEAM EPITAXY; RESONANCE; THERMAL CONDUCTIVITY; THERMAL VARIABLES MEASUREMENT;

CONTINUOUS WAVE OPERATION; FABRY PEROT CAVITY RESONANCE; HORIZONTAL CAVITY EDGE EMITTING LASERS; LASING SPECTRA; THERMAL IMPEDANCE; VERTICAL CAVITY SURFACE EMITTING LASERS;

SEMICONDUCTOR LASERS;

EID: 0030195761     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.118140     Document Type: Article

References (6)

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6. R. S. Geels, B. J. Thibeault, S. W. Corzine, J. W. Scott, and L. A. Coldren, IEEE J. Quantum Electron. QE-29, 1997 (1993).