Thermal resistance of VCSEL's bonded to integrated circuits

IEEE Photonics Technology Letters

Volumn 11, Issue 12, 1999, Pages 1554-1556

  Pu, Rui ^a   Wilmsen, Carl W ^a   Geib, Kent M ^b   Choquette, Kent D ^b  

^a Engineering Research Center and Hydraulics Laboratory   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HEAT RESISTANCE; MATHEMATICAL MODELS; SEMICONDUCTING GALLIUM ARSENIDE; SILICA; THERMAL CONDUCTIVITY OF SOLIDS;

VERTICAL-CAVITY SURFACE-EMITTING LASERS (VCSEL);

SEMICONDUCTOR LASERS;

EID: 0033319164     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/68.806844     Document Type: Article

References (14)

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