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Volumn 43, Issue 6, 2000, Pages 111-112,-114,-116,-118,-121

Modeling CMP for copper dual damascene interconnects

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; DIELECTRIC MATERIALS; ELASTIC MODULI; ELECTROPLATING; MATHEMATICAL MODELS;

EID: 0343442504     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article
Times cited : (7)

References (10)
  • 1
    • 0032010585 scopus 로고    scopus 로고
    • Processing and Integration of Copper Interconnects
    • R.L. Jackson et al., "Processing and Integration of Copper Interconnects," Solid State Technology, Vol. 41, No. 3, pp. 49-59, 1998.
    • (1998) Solid State Technology , vol.41 , Issue.3 , pp. 49-59
    • Jackson, R.L.1
  • 2
    • 0346941038 scopus 로고    scopus 로고
    • Future Interconnect Technologies and Copper Metallization
    • X. W. Lin, D. Pramanik, "Future Interconnect Technologies and Copper Metallization," Solid State Technology, Vol. 41, No. 10, pp. 63-79, 1998.
    • (1998) Solid State Technology , vol.41 , Issue.10 , pp. 63-79
    • Lin, X.W.1    Pramanik, D.2
  • 3
    • 30844441658 scopus 로고    scopus 로고
    • Making the Move to Dual Damascene Processing
    • P. Singer, "Making the Move to Dual Damascene Processing," Semiconductor International, Vol. 20, No. 9, pp. 79-82, 1997.
    • (1997) Semiconductor International , vol.20 , Issue.9 , pp. 79-82
    • Singer, P.1
  • 4
    • 0002926296 scopus 로고    scopus 로고
    • Modeling Step Height Reduction and Local Removal Rates Based on Pad-Substrate Interactions
    • J. Grillaert, M. Meuris, N. Heylen, et al., "Modeling Step Height Reduction and Local Removal Rates Based on Pad-Substrate Interactions," Proc. CMP-MIC Conf., pp. 79-86, 1998.
    • (1998) Proc. CMP-MIC Conf. , pp. 79-86
    • Grillaert, J.1    Meuris, M.2    Heylen, N.3
  • 6
    • 0343088293 scopus 로고    scopus 로고
    • The Use of a Semi-empirical CMP Model for the Optimization of the STI Module
    • J. Grillaert, M. Meuris, E. Vrancken, et al., "The Use of a Semi-empirical CMP Model for the Optimization of the STI Module," Proc. CMP-MIC Conf., pp. 105-112, 1999.
    • (1999) Proc. CMP-MIC Conf. , pp. 105-112
    • Grillaert, J.1    Meuris, M.2    Vrancken, E.3
  • 7
    • 0033076595 scopus 로고    scopus 로고
    • Pattern Planarization Model of Chemical Mechanical Polishing
    • D. Z. Chen, B.S. Lee, "Pattern Planarization Model of Chemical Mechanical Polishing," J. Electrochem. Soc., Vol. 146, pp. 744-748, 1999.
    • (1999) J. Electrochem. Soc. , vol.146 , pp. 744-748
    • Chen, D.Z.1    Lee, B.S.2
  • 8
    • 0001611894 scopus 로고
    • The Theory and Design of Plate-Glass Polishing Machines
    • F. W. Preston, "The Theory and Design of Plate-Glass Polishing Machines," J. Soc. Glass Tech., Vol. 11, pp. 214-256, 1927.
    • (1927) J. Soc. Glass Tech. , vol.11 , pp. 214-256
    • Preston, F.W.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.