Evolution of stress and microstructure in NiFe (20 wt.%) thin films during annealing

Thin Solid Films

Volumn 385, Issue 1-2, 2001, Pages 225-229

  Bruckner W ^a   Thomas, J ^a   Schneider, C M ^a  

^a IFW DRESDEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; AUGER ELECTRON SPECTROSCOPY; ELECTRIC RESISTANCE MEASUREMENT; GRAIN BOUNDARIES; NICKEL ALLOYS; TEMPERATURE MEASUREMENT; TENSILE STRESS; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

IRREVERSIBLE STRESS; MICROSTRUCTURAL EVOLUTION; STRESS EVOLUTION;

THIN FILMS;

EID: 0342592318     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(01)00754-4     Document Type: Article

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