Comparison of experiments with a lumped parameter model of the plasma assisted chemical vapor deposition of copper

Journal of the Electrochemical Society

Volumn 145, Issue 2, 1998, Pages 694-700

  Lakshmanan, Satish K ^a   Gill, William N ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CHEMICAL VAPOR DEPOSITION; COMPOSITION EFFECTS; COPPER COMPOUNDS; DECOMPOSITION; ELECTRIC CONDUCTIVITY OF SOLIDS; GAS ADSORPTION; HYDROGEN; MATHEMATICAL MODELS; PLASMA APPLICATIONS; REACTION KINETICS; SURFACE PHENOMENA;

COPPER HEXAFLUOROACETYLACETONATE; LUMPED PARAMETER MODELS;

METALLIC FILMS;

EID: 0031996542     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838325     Document Type: Review

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