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Volumn 17, Issue 10, 2001, Pages 1306-1312
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Influence of thermal cycling on fatigue strength of Cu/Sn/Cu solder joints
a
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Author keywords
[No Author keywords available]
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Indexed keywords
COBALT;
COPPER;
TIN;
CHEMICAL BINDING;
FATIGUE;
FOIL;
FRACTURE;
REVIEW;
SHEAR STRESS;
STRENGTH;
TEMPERATURE DEPENDENCE;
THERMODYNAMICS;
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EID: 0034783428
PISSN: 02670836
EISSN: None
Source Type: Journal
DOI: 10.1179/026708301101509241 Document Type: Review |
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Times cited : (3)
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References (8)
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