Thermal fatigue analysis of pbga solder joints with the consideration of damage evolution

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-AG, Issue , 2000, Pages 207-212

  Lee, Shi Wei Ricky ^a   Newman, Keith ^b   Hu, Livia ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b SUN MICROSYSTEMS   (United States)

Author keywords

Damage evolution; Plastic ball grid array; Solder joint reliability; Thermal fatigue

Indexed keywords

BALL GRID ARRAYS; ELECTRONICS PACKAGING; FATIGUE DAMAGE; PRINTED CIRCUIT BOARDS; RELIABILITY ANALYSIS; SOLDERED JOINTS; SOLDERING; THERMAL FATIGUE;

DAMAGE EVOLUTION; FATIGUE ANALYSIS; GRID ARRAYS; LIFE PREDICTIONS; PLASTIC BALL GRID ARRAYS; PRINTED CIRCUIT BOARDS ASSEMBLIES; SOLDER BALLS; SOLDER JOINT RELIABILITY; SOLDER JOINTS; THERMAL-CYCLING;

FINITE ELEMENT METHOD;

EID: 85120419492     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-2272     Document Type: Conference Paper

References (11)

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