Effects of PWB size on the warpage of flip chip assemblies

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 27-31

  Yao, Qizhou ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347032947     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

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2. Baker, D. and Kao, V, 1996, "MCMs Take Off", Advanced Packaging, January/February, p16-18.
3. LeGall, C.A., 1996, "Thermalmechanical Stress Analysis of Flip Chip Packages", Master's thesis, School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA.
4. Schubert, A., Dudek, R., Michel, B., and Reichl, H., 1997, "Materials Mechanics and Mechanical Reliability of Flip Chip Assemblies on Organic Substrates". Proceedings of 1997 International Symposium on Advanced Packaging Materials, p 106-109.
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8. Heinrich, S.M., Shakya, S. and Lee, P.S., 1997, "Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joins," J. Electronic Packaging, Vol. 119, pp. 218-227.
9. Peterson, D.W., Sweet, J.N, Burchett, S.N., and Hsia, A., 1997, "Stresses From Flip-Chip Assembly and Underfill; Measurements with the ATC4.1 Assembly Test Chip and Analysis by Finite Element Method", Proceedings of the 1997 Electronic Components and Technology Conference, San Jose, CA, May, pp. 134-143.
10. Hu, K.X., Yeh, C.P., and Wyatt, K., 1997, "Electo- thermomechanical responses of conductive adhesive systems," IEEE CPMT-A, Vol. 20, pp. 470-477.
11. Mura, T., 1991, Micromechanics of Defects in Solids, Kluwer Academic Publishers, 2nd ed.
12. Qu, J., 1993, "Effects of Slightly Weakened Interfaces on the Overall Elastic Properties of Composite Materials," Mechanics of Materials, 14, p.269-281.
13. th International Symposium on Microelectronics, Philadelphia, PA, October.