Thermal fatigue life evaluation for the solder joint ceramic BGA

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 255-261

  Sakai, Hidehisa ^a   Ito, Nobutaka ^a   Kawase, Keiko ^a   Imamura, Kazuyuki ^a   Motegi, Masaki Ohno Masanori ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346402832     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)

1. th Annual Meeting on Computational Mechanics, JSME No.910-79,pp.223-224
2. Qiang Yu, Shiratori Masaki, 1998 ,"Proposal for evaluation process of BGA solder joint fatigue life," JSME RC144 Research group report,pp.529-542