Silicon microprobing array for testing and burn-in

Proceedings of the 1994 IEEE Multi-Chip Module Conference

Volumn , Issue , 1994, Pages 89-94

  Hirano, Toshiki ^a   Kimura, Atsuo ^a   Mori, Shin'ichiro ^a  

^a Tokyo Research Lab ^*  (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; DIES; ELECTRIC CONDUCTIVITY; ELECTRIC CONTACTS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT TESTING; MICROMACHINING; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; SILICON SENSORS; SUBSTRATES; THERMAL EXPANSION;

BURN IN; KNOWN GOOD DIES; MEMBRANE PROBES; MULTICHIP MODULES; SILICON MICROPROBING ARRAY;

PROBES;

EID: 0028272767     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)