Low temperature oxidation of Cu-base leadframe and Cu/EMC interface adhesion

Materials Research Society Symposium - Proceedings

Volumn 445, Issue , 1997, Pages 275-280

  Cho, Soon Jin ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ADHESION; COPPER OXIDES; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); LOW TEMPERATURE EFFECTS; NICKEL COMPOUNDS; OXIDATION; REACTION KINETICS; SHEET MOLDING COMPOUNDS; WETTING; X RAY PHOTOELECTRON SPECTROSCOPY;

LEADFRAMES; MECHANICAL INTERLOCKING EFFECTS;

COPPER ALLOYS;

EID: 0031340733     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)