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Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5039 II, Issue , 2003, Pages 817-826

Most feasible curing process for ArF resist in device integration aspect

(7) Kim, Hyun Woo a Kang, Yool a Lee, Ju Hyung a Chai, Yun Sook a Woo, Sang Gyun a Cho, Han Ku a Han, Woo Sung a

a SAMSUNG Electronics (South Korea)

Author keywords

172nm; ArF; Lithography; VEMA; VUV

Indexed keywords

ARGON; CURING; DRY ETCHING; DYNAMIC RANDOM ACCESS STORAGE; ELECTRON BEAM LITHOGRAPHY; ELECTRON DEVICE MANUFACTURE; INSPECTION; MASKS; SCANNING ELECTRON MICROSCOPY; SILICON NITRIDE; SILICON WAFERS; THICKNESS CONTROL;

CRITICAL DIMENSION; ELECTRON BEAM CURING; PLASMA CURING; THERMAL CURING; ULTRAVIOLET CURING;

PHOTORESISTS;

EID: 0141722783 PISSN: 0277786X EISSN: None Source Type: Conference Proceeding
DOI: 10.1117/12.485119 Document Type: Conference Paper

Times cited : (8)

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